The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Mar. 30, 2011
Guolong Xu, Jiangsu, CN;
LU Yu, Jiangsu, CN;
Hangsheng Wen, Jiangsu, CN;
Michael Francis Bonczyk, McAllen, TX (US);
Guolong Xu, Jiangsu, CN;
Lu Yu, Jiangsu, CN;
Hangsheng Wen, Jiangsu, CN;
Michael Francis Bonczyk, McAllen, TX (US);
Andrew LLC, Hickory, NC (US);
Abstract
The present invention provides a capacitive grounded RF coaxial cable to airstrip transition which comprises a conductive ground plane, an insulating gasket, a reflector plate and an insulating fixing component. The conductive ground plane, the insulating gasket and the reflector plate are attached uniformly and tightly in sequence and fixed together by the insulating fixing component. The outer surface of the conductive ground plane is connected conductively with the outer conductor of the RF coaxial cable. Preferably, the conductive ground plane is a metal plate and the insulating gasket is a plastic gasket. The capacitive grounded RF coaxial cable to airstrip transition further comprises at least one perforation penetrating the conductive ground plane, the insulating gasket and the reflector plate in sequence. The insulating fixing component includes at least one insulating rivet and at least one conductive supporting piece is arranged on the outer surface of the conductive ground plane. The present invention further provides an antenna comprising this transition. Therefore the present invention is designed skillfully, simple in structure, simple and convenient to assemble, has a low cost, avoids metals' direct contact to obviate the difficulty of maintaining the constant surface pressure, and realizes the grounding without producing third-order intermodulation, to completely eliminate unstable factors, and therefore is suitable for large-scale popularization.