The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Jul. 23, 2012
Applicants:
Hiroshi Goto, Shizuoka-Ken, JP;
Hiroshi Okuyama, Shizuoka-Ken, JP;
Mitsunori Kokubo, Shizuoka-Ken, JP;
Kentaro Ishibashi, Shizuoka-Ken, JP;
Inventors:
Hiroshi Goto, Shizuoka-Ken, JP;
Hiroshi Okuyama, Shizuoka-Ken, JP;
Mitsunori Kokubo, Shizuoka-Ken, JP;
Kentaro Ishibashi, Shizuoka-Ken, JP;
Assignee:
Toshiba Kikai Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
Abstract
A micropattern is joined to a substrate (W) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.
Goto, Hiroshi. (2014). Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die (U.S. Patent No. 8703618). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8703618
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile