The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Dec. 28, 2011
Applicant:
SI Han Kim, Yongin-si, KR;
Inventor:
Si Han Kim, Yongin-si, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package includes a substrate having a connection terminal with a groove on its surface. Nanopowder may be disposed on a bottom of the groove. A semiconductor chip may be flip-chip bonded to the substrate by the nanopowder. A filler member may be interposed between the substrate and the semiconductor chip.
Kim, Si. (2014). Semiconductor package and method for manufacturing the same (U.S. Patent No. 8703533). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8703533
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile