The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2014

Filed:

Mar. 28, 2011
Applicants:

Hyun-yong Cho, Uiwang-si, KR;

Doo-young Jung, Uiwang-si, KR;

Yong-sik Yoo, Uiwang-si, KR;

Ji-young Jeong, Uiwang-si, KR;

Jong-hwa Lee, Uiwang-si, KR;

Min-kook Chung, Uiwang-si, KR;

Kil-sung Lee, Uiwang-si, KR;

Myoung-hwan Cha, Uiwang-si, KR;

Inventors:

Hyun-Yong Cho, Uiwang-si, KR;

Doo-Young Jung, Uiwang-si, KR;

Yong-Sik Yoo, Uiwang-si, KR;

Ji-Young Jeong, Uiwang-si, KR;

Jong-Hwa Lee, Uiwang-si, KR;

Min-Kook Chung, Uiwang-si, KR;

Kil-Sung Lee, Uiwang-si, KR;

Myoung-Hwan Cha, Uiwang-si, KR;

Assignee:

Cheil Industries Inc., Gumi-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/022 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0226 (2013.01); Y10S 430/107 (2013.01);
Abstract

A positive photosensitive resin composition includes: (A) a polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a polyamic acid ester compound; and (E) a solvent. The positive photosensitive resin composition can reduce film shrinkage, can have high sensitivity, high resolution, and excellent residue removal properties, and can provide good pattern shapes.


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