The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2014

Filed:

Apr. 30, 2010
Applicants:

Mark Baker, Livermore, CA (US);

Joseph Coakley, Dublin, CA (US);

Paul William Martens, Pleasanton, CA (US);

Albert L. Ollerdessen, Danville, CA (US);

William Patrick Pennybacker, Livermore, CA (US);

Jesse Nicasio Rosen, Albany, CA (US);

Peter Yee, San Ramon, CA (US);

John W. Allison, Los Altos, CA (US);

Bryan Weber, Livermore, CA (US);

Inventors:

Mark Baker, Livermore, CA (US);

Joseph Coakley, Dublin, CA (US);

Paul William Martens, Pleasanton, CA (US);

Albert L. Ollerdessen, Danville, CA (US);

William Patrick Pennybacker, Livermore, CA (US);

Jesse Nicasio Rosen, Albany, CA (US);

Peter Yee, San Ramon, CA (US);

John W. Allison, Los Altos, CA (US);

Bryan Weber, Livermore, CA (US);

Assignee:

Zeltiq Aesthetics, Inc., Pleasanton, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Devices, systems and methods for removing heat from subcutaneously disposed lipid-rich cells are disclosed. In selected embodiments, suction and/or heat removal sources are coupled to an applicator. The applicator includes a flexible portion and a rigid portion. The rigid portion includes a thermally conductive plate and a frame coupling the thermally conductive plate and the flexible portion. An interior cavity of the applicator is in fluid communication with the suction source, and the frame maintains contiguous engagement between the heat removal source and the thermally conductive plate.


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