The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2014

Filed:

Mar. 01, 2010
Applicants:

Kohji Hisakawa, Osaka, JP;

Hiroyuki Oonishi, Osaka, JP;

Inventors:

Kohji Hisakawa, Osaka, JP;

Hiroyuki Oonishi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/04 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
Abstract

A conductive buffer material () is one surface of a display panel () sandwiched between a first member (BZ) and a second member (CS), and is interposed between a first panel surface facing the metallic first member (BZ) and the first member (BZ). The conductive buffer material () includes an inclusion material () and a conductive envelope material () that wraps the inclusion material (), and the conductive buffer material () includes a main portion in which part of the envelope material () is brought closer to the first panel surface and the first member (BZ) by the inclusion material () having a given thickness or more.


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