The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Mar. 28, 2012
Scott D. Brandenburg, Kokomo, IN (US);
Richard D. Parker, Tipton, IN (US);
Erich W. Gerbsch, Cicero, IN (US);
Gary L. Eesley, Kokomo, IN (US);
Carl W. Berlin, West Lafayette, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
Richard D. Parker, Tipton, IN (US);
Erich W. Gerbsch, Cicero, IN (US);
Gary L. Eesley, Kokomo, IN (US);
Carl W. Berlin, West Lafayette, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.