The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Dec. 18, 2009
Tetsuya Nakamura, Kanagawa, JP;
Takahiro Sakai, Kanagawa, JP;
Masahiko Katoh, Kanagawa, JP;
Yasushi Inoue, Kanagawa, JP;
Tetsuya Nakatsuka, Kanagawa, JP;
Satoshi Kaneko, Kanagawa, JP;
Masashi Okubo, Kanagawa, JP;
Tetsuya Nakamura, Kanagawa, JP;
Takahiro Sakai, Kanagawa, JP;
Masahiko Katoh, Kanagawa, JP;
Yasushi Inoue, Kanagawa, JP;
Tetsuya Nakatsuka, Kanagawa, JP;
Satoshi Kaneko, Kanagawa, JP;
Masashi Okubo, Kanagawa, JP;
HGST Netherlands B.V., Amsterdam, NL;
Abstract
A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.