The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Aug. 30, 2012
Tae-gyu Kang, Chungcheongnam-do, KR;
Ho-tae Jin, Chungcheongnam-do, KR;
Tae-ho Moon, Chungcheongnam-do, KR;
Il-soo Choi, Chungcheongnam-do, KR;
Jong-eun Lee, Suwon-si, KR;
Tae-Gyu Kang, Chungcheongnam-do, KR;
Ho-Tae Jin, Chungcheongnam-do, KR;
Tae-ho Moon, Chungcheongnam-do, KR;
Il-soo Choi, Chungcheongnam-do, KR;
Jong-Eun Lee, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A package substrate may include an insulating substrate, a dummy pad, a signal pad and a plug. The dummy pad may be formed on an upper surface of the insulating substrate. The signal pad may be formed on the upper surface of the insulating substrate. The signal pad may have an upper surface protruded from an upper surface of the dummy pad. The plug may be vertically formed in the insulating substrate. The plug may have an upper end exposed through the upper surface of the insulating substrate and connected with the signal pad and the dummy pad, and a lower end exposed through a lower surface of the insulating substrate. Thus, a signal bump may accurately make contact with the protruded upper surface of the signal pad.