The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2014

Filed:

Mar. 24, 2009
Applicant:

Masaki Muramatsu, Aichi, JP;

Inventor:

Masaki Muramatsu, Aichi, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An objective is to provide a component-incorporated wiring substrate capable of solving a problem caused by an increase in length of wiring lines that connect a component and a capacitor. A component-incorporated wiring substrateincludes a core substrate, a first capacitor, a wiring laminate portion, and a second capacitor. An accommodation hole portionof the core substrateaccommodates the first capacitortherein, and a component-mounting regionis set on a surfaceof the wiring laminate portion. The second capacitorhas electrode layersand a dielectric layer. The second capacitoris embedded in the wiring laminate portionin such a state that first main surfacesand second main surfacesare in parallel with the surfaceof the wiring laminate portion, and is disposed between the first capacitorand the component-mounting region


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