The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Sep. 25, 2006
Applicants:
Hans-joachim Barth, München, DE;
Andreas Rusch, Hohenbrunn, DE;
Klaus Schrüfer, Baldham, DE;
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic circuit arrangement has a substrate which has at least one metallization layer. At least one electrical interconnect and/or at least one via are formed in the metallization layer such that the electrical interconnect and the via are in the form of an electrical fuse link. In addition, the substrate has electrical circuit components which are arranged in the circuit layer. The circuit components are electrically coupled to one another by means of the electrical interconnect and by means of a plurality of vias.