The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Feb. 12, 2009
Hajime Kishi, Himeji, JP;
Yumi Kunimitsu, Himeji, JP;
Jin Imade, Himeji, JP;
Shinya Oshita, Kamisu, JP;
Yoshihiro Morishita, Kamisu, JP;
Mitsunori Asada, Kurashiki, JP;
Hajime Kishi, Himeji, JP;
Yumi Kunimitsu, Himeji, JP;
Jin Imade, Himeji, JP;
Shinya Oshita, Kamisu, JP;
Yoshihiro Morishita, Kamisu, JP;
Mitsunori Asada, Kurashiki, JP;
Kuraray Co., Ltd., Kurashiki-shi, JP;
Hyogo, Kobe-shi, JP;
Abstract
A curable resin composition, which contains, with respect to 100 parts of an epoxy resin, 1 to 70 parts of an epoxy resin curing agent and 1 to 50 parts of an acrylic block copolymer, and the acrylic block copolymer contains (α) at least one polymer block A composed of a structural unit derived from an alkyl methacrylate and at least one polymer block B composed of a structural unit derived from an alkyl acrylate, has a weight average molecular weight (Mw) of 30,000 to 300,000 and a molecular weight distribution (Mw/Mn) of 1.5 or less, and contains 3 to 60 percent by mass of the polymer block A. In addition, a cured resin is formed from the above curable resin composition.