The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2014

Filed:

Mar. 15, 2011
Applicants:

Kazuhiko Adachi, Miyagi, JP;

Takayuki Yamaguchi, Miyagi, JP;

Inventors:

Kazuhiko Adachi, Miyagi, JP;

Takayuki Yamaguchi, Miyagi, JP;

Assignee:

Ricoh Company, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/385 (2006.01); G02B 26/08 (2006.01); H01S 5/00 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a surface emitting laser module including a surface emitting laser element formed in a semiconductor substrate and having a surface emitting laser array that emits light in a direction perpendicular to a surface of the semiconductor substrate; a package having a region in which the semiconductor substrate is provided; and a metal cap having a cylindrical part formed of metal, the cylindrical part having a transparent substrate on one side thereof and a bottom part on the other side thereof bonded to the package. The transparent substrate is provided in the metal cap in such a manner as to be inclined with respect to the semiconductor substrate, the package has a metal part at a bonding part thereof bonded to the metal cap, and the metal part and the metal cap are bonded together by welding.


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