The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2014

Filed:

Jun. 21, 2012
Applicants:

Keith K. Sturcken, Nokesville, VA (US);

John A. Hughes, Falls Church, VA (US);

Thomas E. Love, Gainesville, VA (US);

Sheila J. Konecke, Leesburg, VA (US);

Jeffrey Montag, Brandy Station, VA (US);

Peter M. Wallace, Newfields, NH (US);

Inventors:

Keith K. Sturcken, Nokesville, VA (US);

John A. Hughes, Falls Church, VA (US);

Thomas E. Love, Gainesville, VA (US);

Sheila J. Konecke, Leesburg, VA (US);

Jeffrey Montag, Brandy Station, VA (US);

Peter M. Wallace, Newfields, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.


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