The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8696864 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 15, 2014

Filed:

Jan. 25, 2013
Applicants:

Promerus Llc, Brecksville, OH (US);

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Inventors:

Venkat Dukkipati, Copley, OH (US);

Kei Kawasaki, Tokyo, JP;

Larry F. Rhodes, Silver Lake, OH (US);

Toshihiro Sato, Tokyo, JP;

Assignees:

Promerus, LLC, Brecksville, OH (US);

Sumitomo Bakelite Co., Ltd, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.


Find Patent Forward Citations

Dukkipati, Venkat. (2014). Room temperature debonding composition, method and stack (U.S. Patent No. 8696864). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8696864

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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