The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Nov. 17, 2008
Atsushi Murai, Kuwana, JP;
Kazuhiro Hosoe, Aisai, JP;
Atsushi Murai, Kuwana, JP;
Kazuhiro Hosoe, Aisai, JP;
Denso Corporation, Kariya, JP;
Abstract
A bonding material and a related manufacturing method are disclosed in which an unfired ceramic body A, internally formed with a cavity portion or a surface formed with a concaved portion, and an unfired ceramic body B are bonded to each other. The bonding material is applied to a bonding area between the unfired ceramic bodies A and B in a thickness ranging from 10 to 25 μm to provide a bonded body that is fired to obtain a ceramic bonded body. The bonding material contains an inorganic powder, an organic binder and an organic solvent in a composition to satisfy relationships 0≦X—Z≦2.6 and 0≦Y—Z≦2.6 where 'X' represents a firing contraction ratio (%) of the unfired ceramic body A, 'Y' a firing contraction ratio (%) of the unfired ceramic body B, and “Z” a firing contraction ratio of tie bonding material.