The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Aug. 05, 2010
Takeshi Sugiyama, Chiba, JP;
Takeshi Sugiyama, Chiba, JP;
Seiko Instruments Inc., Chiba, JP;
Abstract
Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid boardis superimposed onto an inner surface of the base board, and an outer surface of the base boardis disposed on an electrode base portionfor anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding filmand the electrode base portionwhile heating them to a bonding temperature, whereby the bonding filmand the base boardare anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodesare exposed to a void portionformed in the electrode base portion