Large area light emitting electrical package with current spreading bus

Abstract

Disclosed herein is a light emitting electrical package having a first electrode layer comprising a substantially transparent nonmetallic conductive material, and a plurality of light emitting elements disposed on said first electrode layer. The first electrode layer comprises a peripheral region, and an elongated bus is disposed on at least a portion of the peripheral region and adjacent the first electrode layer. The elongated bus is configured to spread current across a length dimension of said first electrode layer. Also disclosed are elongated bus structure designed intended to reduce the resistive losses along a transparent nonmetallic conductive contact at its edge or periphery. One design for an elongated bus comprises: (1) a conductive adhesive/metal foil/conductive adhesive sandwich structure; (2) another design comprises a vapor deposited bus of one or more materials; and a further design employs (1) and (2) in tandem.