The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Feb. 25, 2010
Applicants:
Takashi Kitazawa, Kumagaya, JP;
Yasushige Sakamoto, Ota, JP;
Motoaki Wakui, Kumagaya, JP;
Inventors:
Assignee:
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor element () is secured to an island (), and a plurality of through-holes () are formed in the portion of the island (), which surrounds the area to which the semiconductor element () is secured. Further, the electrode pads of the semiconductor element () and leads () are electrically connected by copper wires (). In this structure, the cost of materials is reduced by using the copper wires () in comparison with gold wires. Further, a part of a resin package () is embedded in through-holes (), so that the island () can be easily supported within the resin package ().