The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2014

Filed:

Sep. 20, 2011
Applicants:

Hiroshi Shinohara, Mie-ken, JP;

Daigo Ichinose, Mie-ken, JP;

Inventors:

Hiroshi Shinohara, Mie-ken, JP;

Daigo Ichinose, Mie-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/792 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can include selectively implanting an impurity into a underlying layer containing silicon using a mask to form a boron-added region and an etched region. The boron-added region contains boron, and a boron concentration of the etched region is lower than a boron concentration in the boron added region. The method can include forming a pair of holes reaching the etched region in the stacked body including a plurality of layers of electrode layers. The method can include forming a depression part connected to a lower end of each of the pair of holes in the underlying layer by removing the etched region through the holes using an etching solution.


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