The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Nov. 08, 2012
Texas Instruments Incorporated, Dallas, TX (US);
Virgil C. Ararao, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A microelectromechanical (MEMS) device is fabricated from a wafer having a plurality of die regions with grooves and MEMS components formed on a wafer surface at each die region. A first metal having a relatively high melting temperature is formed on sidewalls of each groove, and a cap is attached at each die region to provide a closed cavity which encloses the grooves and MEMS components. Bottoms of the grooves are opened by thinning the wafer thereby establishing through-hole vias extending through the wafer at each die region, for accessing the cavity for inserting or removing material. The vias are sealed by interacting a second metal having a relatively low melting temperature with the first metal layer to form intermetallic compounds with higher melting temperature that maintain the seal during subsequent lower temperature operations.