The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
May. 29, 2012
Hung-jen Chen, Taichung, TW;
Kuan-hsun Chiu, Taichung, TW;
Chun-chieh Wang, Taichung, TW;
Ming-li Hsu, Taichung, TW;
Hung-Jen Chen, Taichung, TW;
Kuan-Hsun Chiu, Taichung, TW;
Chun-Chieh Wang, Taichung, TW;
Ming-Li Hsu, Taichung, TW;
Merry Electronics Co., Ltd., Taichung, TW;
Abstract
A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.