The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Dec. 07, 2012
Tdk Corporation, Tokyo, JP;
Sae Magnetics (H.k.) Ltd., Hong Kong, CN;
Seiichi Takayama, Tokyo, JP;
Yasuhiro Ito, Tokyo, JP;
Nobuyuki Mori, Tokyo, JP;
Koji Shimazawa, Tokyo, JP;
Kazuaki Takanuki, Tokyo, JP;
Youichi Ando, Tokyo, JP;
TDK Corporation, Tokyo, JP;
SAE Magnetics (H.K.) Ltd., Hong Kong, CN;
Abstract
A method of manufacturing an electronic device includes a first bonding step of bonding an electronic component and a first member together via a first bonding layer and a second bonding step of bonding the first member and a second member together via a second bonding layer after the first bonding step. The second bonding layer includes a bonding material layer made of a bonding material. In the second bonding step, with the bonding material interposed between the first and second members before being bonded together, the bonding material is heated and melted using light traveling through the first member. The first member is made of Si. The light has a wavelength in the range of 1100 to 15000 nm.