The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Jun. 12, 2012
Applicants:
Teppei Akazawa, Nagaokakyo, JP;
Kenjiro Hadano, Nagaokakyo, JP;
Masahiro Sakuratani, Nagaokakyo, JP;
Inventors:
Teppei Akazawa, Nagaokakyo, JP;
Kenjiro Hadano, Nagaokakyo, JP;
Masahiro Sakuratani, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/005 (2006.01); H01G 4/06 (2006.01); H01G 4/228 (2006.01);
U.S. Cl.
CPC ...
Abstract
A laminated ceramic electronic component includes curved surface portions provided in an outer surface of a ceramic element assembly, and internal conductors provided within the ceramic element assembly that are exposed in the curved surface portions and principal surfaces to define starting points for plating deposition. A base layer, in an external conductor, which is defined by a plating film is arranged so as to directly cover the exposed portions of the internal conductors.