The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Mar. 22, 2011
Kazuhiro Inoue, Fukuoka-ken, JP;
Kazuhisa Iwashita, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Gen Watari, Fukuoka-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Tatsuo Tonedachi, Hyogo-ken, JP;
Kazuhiro Inoue, Fukuoka-ken, JP;
Kazuhisa Iwashita, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Gen Watari, Fukuoka-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Tatsuo Tonedachi, Hyogo-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.