The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2014

Filed:

Aug. 29, 2011
Applicants:

Boon W. Shiu, San Jose, CA (US);

Yi Jiang, Sunnyvale, CA (US);

Chun-lung Chen, Sunnyvale, CA (US);

Robert W. Schlub, Cupertino, CA (US);

Ruben Caballero, San Jose, CA (US);

Inventors:

Boon W. Shiu, San Jose, CA (US);

Yi Jiang, Sunnyvale, CA (US);

Chun-Lung Chen, Sunnyvale, CA (US);

Robert W. Schlub, Cupertino, CA (US);

Ruben Caballero, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device may have a housing in which an antenna and a proximity sensor formed from flex circuit structures are mounted. The flex circuit structures may include first and second flex circuit layers. The first and second flex circuit layers may include metal antenna structures and metal proximity sensor electrode structures. Solder may be used to attach electrical components to the flex circuit layers and may be used to electrically connect metal structures on the first and second flex circuit layers to each other. The first and second flex circuit layers may be laminated together using a compressive fixture. The compressive fixture may have a first fixture with a convex surface and a second fixture with a concave surface so that the laminated flex circuit layers are provided with a bend.


Find Patent Forward Citations

Shiu, Boon. (2014). Laminated flex circuit layers for electronic device components (U.S. Patent No. 8686297). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8686297

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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