The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Nov. 07, 2009
Chang Hyun Lim, Seoul, KR;
Seog Moon Choi, Seoul, KR;
Sang Hyun Shin, Gyunggi-do, KR;
Young Ki Lee, Gyunggi-do, KR;
Sung Keun Park, Gyunggi-do, KR;
Chang Hyun Lim, Seoul, KR;
Seog Moon Choi, Seoul, KR;
Sang Hyun Shin, Gyunggi-do, KR;
Young Ki Lee, Gyunggi-do, KR;
Sung Keun Park, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.