The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Sep. 24, 2008
Yoshio Sugimoto, Ichihara, JP;
Hiroshi Suenari, Chiba, JP;
Ikunori Sakai, Ichihara, JP;
Frank E. Jones, Franklin, TN (US);
Toru Fukada, Tipp City, OH (US);
Yoshio Sugimoto, Ichihara, JP;
Hiroshi Suenari, Chiba, JP;
Ikunori Sakai, Ichihara, JP;
Frank E. Jones, Franklin, TN (US);
Toru Fukada, Tipp City, OH (US);
Prime Polymer Co., Ltd., Tokyo, JP;
Abstract
Polypropylene resin compositions are suited for injection molding and are capable of giving molded articles having excellent mechanical properties, reduced tendency to cause flow marks or weld marks, low gloss, and superior scratch resistance. A polypropylene resin composition includes: an amount of a resin composition (F) including a polypropylene (A), an ethylene-α-olef in copolymer or an ethylene-α-olefin-diene copolymer (B-I) having MFR of less than 0.4 g/10 min, an ethylene-α-olefin copolymer (B-2) having MFR of 0.5 to less than 20 g/10 min, and an inorganic filler (C); and specific amounts relative to the resin composition (F) of a modified polypropylene (D) and a surface modifier (E).