The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2014

Filed:

Nov. 29, 2010
Applicants:

Takashi Nakayama, Tokyo, JP;

Tomoyuki Kabasawa, Tokyo, JP;

Takayuki Kihara, Tokyo, JP;

Inventors:

Takashi Nakayama, Tokyo, JP;

Tomoyuki Kabasawa, Tokyo, JP;

Takayuki Kihara, Tokyo, JP;

Assignee:

Sumco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); B31D 3/00 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A tray for film formation by a CVD method includes a tray main body () and a supporting member () mounted on the tray main body () for supporting a silicon wafer (). The supporting member () has a holding portion (), on which the silicon wafer () is directly placed. The holding portion () has its lower surface () apart from a surface () of the tray main body that is opposed to and apart from the supported silicon wafer (), whereby the thickness distribution of an oxide film formed on the silicon wafer can be made uniform. The tray has a structure for reducing a contact area between the supporting member () and the tray main body (), with the holding portion () having a tilted surface with its inner circumferential side closer to the tray main body surface () that is opposed to the silicon wafer.


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