The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Mar. 12, 2003
Fumitsugu Fukuyo, Hamamatsu, JP;
Kenshi Fukumitsu, Hamamatsu, JP;
Naoki Uchiyama, Hamamatsu, JP;
Toshimitsu Wakuda, Hamamatsu, JP;
Kazuhiro Atsumi, Hamamatsu, JP;
Kenichi Muramatsu, Hamamatsu, JP;
Fumitsugu Fukuyo, Hamamatsu, JP;
Kenshi Fukumitsu, Hamamatsu, JP;
Naoki Uchiyama, Hamamatsu, JP;
Toshimitsu Wakuda, Hamamatsu, JP;
Kazuhiro Atsumi, Hamamatsu, JP;
Kenichi Muramatsu, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified regionformed by multiphoton absorption forms a cutting start regionwithin an object to be processedalong a line to cut. Thereafter, the objectis irradiated with laser light Labsorbable by the objectalong the line to cut, so as to generate fracturesfrom the cutting start regionacting as a start point, whereby the objectcan accurately be cut along the line to cut. Expanding an expandable filmhaving the objectsecured thereto separates individual chipsfrom each other, which can further improve the reliability in cutting the objectalong the line to cut