The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2014

Filed:

Mar. 13, 2012
Applicants:

Yoshinobu Suehiro, Aichi-ken, JP;

Mitsuhiro Inoue, Aichi-ken, JP;

Hideaki Kato, Aichi-ken, JP;

Kunihiro Hadame, Aichi-ken, JP;

Ryoichi Tohmon, Aichi-ken, JP;

Satoshi Wada, Aichi-ken, JP;

Koichi Ota, Aichi-ken, JP;

Kazuya Aida, Saitama-ken, JP;

Hiroki Watanabe, Saitama-ken, JP;

Yoshinori Yamamoto, Saitama-ken, JP;

Masaaki Ohtsuka, Saitama-ken, JP;

Naruhito Sawanobori, Saitama-ken, JP;

Inventors:

Yoshinobu Suehiro, Aichi-ken, JP;

Mitsuhiro Inoue, Aichi-ken, JP;

Hideaki Kato, Aichi-ken, JP;

Kunihiro Hadame, Aichi-ken, JP;

Ryoichi Tohmon, Aichi-ken, JP;

Satoshi Wada, Aichi-ken, JP;

Koichi Ota, Aichi-ken, JP;

Kazuya Aida, Saitama-ken, JP;

Hiroki Watanabe, Saitama-ken, JP;

Yoshinori Yamamoto, Saitama-ken, JP;

Masaaki Ohtsuka, Saitama-ken, JP;

Naruhito Sawanobori, Saitama-ken, JP;

Assignees:

Toyoda Gosei Co., Ltd., Nishikasugai-Gun, Aichi-Ken, JP;

Sumita Optical Glass Inc., Saitama-Shi, Saitama-Ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.


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