The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8685495 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 01, 2014

Filed:

Jun. 25, 2009
Applicants:

Morio Tomiyama, Nara, JP;

Yuuko Tomekawa, Osaka, JP;

Inventors:

Morio Tomiyama, Nara, JP;

Yuuko Tomekawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/40 (2006.01); B05D 3/12 (2006.01); B05D 1/18 (2006.01); B05C 13/00 (2006.01); B05C 11/00 (2006.01); B05C 13/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate formed of an organic-inorganic hybrid material and provided with a reinforcement member in an inner periphery portion is used, as a signal transfer substrate, in a method for procuring a multilayer information recording medium having 'n' information recording layers ('n' is an integer of two or more), the method including: applying an ultraviolet curable resin on a “k”th information recording layer (“k” is an integer of from 1 to (n−1)); bonding the signal transfer substrate having a signal surface including a concavo-convex shaped signal portion, to the applied resin, with the signal surface facing the resin; curing the resin by applying an ultraviolet ray to the resin from the substrate side while the substrate is bonded to the resin; and peeling the substrate from the cured resin by warping the inner periphery portion of the substrate. This method enables the signal transfer substrate to be used repeatedly.


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