The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2014

Filed:

Apr. 06, 2009
Applicants:

Shawn O'rourke, Tempe, AZ (US);

Douglas Loy, Chandler, AZ (US);

Hanqing Jiang, Chandler, AZ (US);

Inventors:

Shawn O'Rourke, Tempe, AZ (US);

Douglas Loy, Chandler, AZ (US);

Hanqing Jiang, Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); C09J 7/02 (2006.01); C09J 4/00 (2006.01); C09J 101/00 (2006.01); C09J 201/00 (2006.01); B32B 27/00 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.


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