The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2014

Filed:

Mar. 15, 2012
Applicants:

Wu-jung Tsai, Hsinchu, TW;

Chung-wei Cheng, Hsinchu, TW;

Mi-ching Tsai, Hsinchu, TW;

Wu-sung Yao, Hsinchu, TW;

Sheng-he Wang, Hsinchu, TW;

Inventors:

Wu-Jung Tsai, Hsinchu, TW;

Chung-Wei Cheng, Hsinchu, TW;

Mi-Ching Tsai, Hsinchu, TW;

Wu-Sung Yao, Hsinchu, TW;

Sheng-He Wang, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01D 49/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes.


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