The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2014

Filed:

Sep. 24, 2010
Applicants:

John R. Andrews, Fairport, NY (US);

Thomas E. Orlowski, Webster, NY (US);

Inventors:

John R. Andrews, Fairport, NY (US);

Thomas E. Orlowski, Webster, NY (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.


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