The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2014
Filed:
Mar. 09, 2011
Kambiz Vafai, Mission Viejo, CA (US);
Abdul Rahim Assaad Khaled, Jeddah, SA;
Kambiz Vafai, Mission Viejo, CA (US);
Abdul Rahim Assaad Khaled, Jeddah, SA;
Kambix Innovations, LLC, Albuquerque, NM (US);
Abstract
Devices and methods for increasing and decreasing cooling capacity as thermal load increases by utilizing bimaterial. For increasing the cooling capacity, the upper plate of a thin film microchannel can be configured from a bimaterial, such that the upper layer possesses a higher linear thermal expansion coefficient than that of the lower layer material. Excessive heating causes the coolant temperature to increase which in turn heats the upper plate. As such, the upper plate bends outward allowing for more coolant to flow within the thin film. For decreasing the cooling capacity, the upper plate can be configured from a bimaterial such that its lower layer has a higher linear thermal expansion coefficient than that of the upper layer material. Excessive heating can cause the coolant temperature to increase, which in turn heats the upper plate. As such, the upper plate can bend inward resulting in less coolant flow within the thin film.