The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8683684 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 01, 2014

Filed:

Oct. 05, 2011
Applicants:

Suk-hyeon Cho, Suwon-si, KR;

Je-gwang Yoo, Yongin-si, KR;

Byung-moon Kim, Goyang-si, KR;

Han-seo Cho, Daejeon, KR;

Inventors:

Suk-Hyeon Cho, Suwon-si, KR;

Je-Gwang Yoo, Yongin-si, KR;

Byung-Moon Kim, Goyang-si, KR;

Han-Seo Cho, Daejeon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.


Find Patent Forward Citations

Cho, Suk-Hyeon. (2014). Method of manufacturing component embedded printed circuit board (U.S. Patent No. 8683684). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8683684

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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