The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8682130 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 25, 2014

Filed:

Sep. 13, 2011
Applicants:

Lauren Palmateer, San Francisco, CA (US);

William J. Cummings, Clinton, WA (US);

Brian Gally, Lost Gatos, CA (US);

Mark Miles, Atlanta, GA (US);

Jeffrey B. Sampsell, Pueblo, CO (US);

Clarence Chui, San Jose, CA (US);

Manish Kothari, Cupertino, CA (US);

Inventors:

Lauren Palmateer, San Francisco, CA (US);

William J. Cummings, Clinton, WA (US);

Brian Gally, Lost Gatos, CA (US);

Mark Miles, Atlanta, GA (US);

Jeffrey B. Sampsell, Pueblo, CO (US);

Clarence Chui, San Jose, CA (US);

Manish Kothari, Cupertino, CA (US);

Assignee:

QUALCOMM Mems Technologies, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/00 (2006.01); G02B 26/00 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
G02B 26/007 (2013.01); G02B 26/0833 (2013.01); G02B 26/0825 (2013.01);
Abstract

A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.


Find Patent Forward Citations

Palmateer, Lauren. (2014). Method and device for packaging a substrate (U.S. Patent No. 8682130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8682130

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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