The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8681509 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 25, 2014

Filed:

Aug. 19, 2009
Applicant:

Hideaki Hirasawa, Fuji, JP;

Inventor:

Hideaki Hirasawa, Fuji, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.


Find Patent Forward Citations

Hirasawa, Hideaki. (2014). Printed circuit board (U.S. Patent No. 8681509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8681509

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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