The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2014

Filed:

Jan. 26, 2012
Applicants:

Daisuke Nishiyama, Sayama, JP;

Kenji Kasahara, Sayama, JP;

Hiroyuki Murakoshi, Sayama, JP;

Inventors:

Daisuke Nishiyama, Sayama, JP;

Kenji Kasahara, Sayama, JP;

Hiroyuki Murakoshi, Sayama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.


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