The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Nov. 12, 2007
Applicants:
Giuseppe Miccoli, Dresden, DE;
Bhaskaran Jayachandran, Dresden, DE;
Friedrich Steffen, Radeberg, DE;
Alfred Vater, Dresden, DE;
Inventors:
Giuseppe Miccoli, Dresden, DE;
Bhaskaran Jayachandran, Dresden, DE;
Friedrich Steffen, Radeberg, DE;
Alfred Vater, Dresden, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer includes a plurality of chips, each of the chips being spaced from each other by kerf-line regions including a reduced width.
Miccoli, Giuseppe. (2014). Wafer and a method of dicing a wafer (U.S. Patent No. 8680653). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8680653
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile