The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2014

Filed:

Mar. 19, 2012
Applicants:

Hiroshi Ohta, Hyogo-ken, JP;

Yasuto Sumi, Hyogo-ken, JP;

Kiyoshi Kimura, Hyogo-ken, JP;

Junji Suzuki, Hyogo-ken, JP;

Hiroyuki Irifune, Hyogo-ken, JP;

Inventors:

Hiroshi Ohta, Hyogo-ken, JP;

Yasuto Sumi, Hyogo-ken, JP;

Kiyoshi Kimura, Hyogo-ken, JP;

Junji Suzuki, Hyogo-ken, JP;

Hiroyuki Irifune, Hyogo-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

A power semiconductor device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer provided thereon, mutually separated columnar third semiconductor layers of a second conductivity type extending within the second semiconductor layer, island-like fourth semiconductor layers of the second conductivity type provided on the third semiconductor layers, fifth semiconductor layers of the first conductivity type, sixth semiconductor layers of the second conductivity type, a gate electrode, a first electrode, and a second electrode. The fifth semiconductor layers are selectively provided on the fourth semiconductor layers. The sixth semiconductor layer electrically connects two adjacent fourth semiconductor layers. The first electrode is in electrical connection with the first semiconductor. The second electrode is in electrical connection with the fourth semiconductor layers and the fifth semiconductor layers via the openings in the gate electrode.


Find Patent Forward Citations

Loading…