The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Sep. 21, 2012
Ngk Insulators, Ltd., Nagoya, JP;
Morimichi Watanabe, Nagoya, JP;
Yuji Katsuda, Tsushima, JP;
Toru Hayase, Nagoya, JP;
Asumi Jindo, Okazaki, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
Initially, an YbOraw material was subjected to uniaxial pressure forming at a pressure of 200 kgf/cm, so that a disc-shaped compact having a diameter of about 35 mm and a thickness of about 10 mm was produced, and was stored into a graphite mold for firing. Subsequently, firing was performed by using a hot-press method at a predetermined firing temperature (1,500° C.), so as to obtain a corrosion-resistant member for semiconductor manufacturing apparatus. The press pressure during firing was specified to be 200 kgf/cmand an Ar atmosphere was kept until the firing was finished. The retention time at the firing temperature (maximum temperature) was specified to be 4 hours. In this manner, the corrosion-resistant member for semiconductor manufacturing apparatus made from an YbOsintered body having an open porosity of 0.2% was obtained.