The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Jun. 30, 2011
Jong Won Chung, Hwaseong-si, KR;
Christopher J. Bettinger, Boston, MA (US);
Zhenan Bao, Stanford, CA (US);
DO Hwan Kim, Anyang-si, KR;
Bang Lin Lee, Suwon-si, KR;
Jeong IL Park, Seongnam-si, KR;
Yong Wan Jin, Seoul, KR;
Sang Yoon Lee, Seoul, KR;
Jong Won Chung, Hwaseong-si, KR;
Christopher J. Bettinger, Boston, MA (US);
Zhenan Bao, Stanford, CA (US);
Do Hwan Kim, Anyang-si, KR;
Bang Lin Lee, Suwon-si, KR;
Jeong Il Park, Seongnam-si, KR;
Yong Wan Jin, Seoul, KR;
Sang Yoon Lee, Seoul, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
The United States of America as represented by the National Institutes of Health (NIH), Washington, DC (US);
The United States of America as represented by the Dept. of Health and Human Services (DHHS), Washington, DC (US);
Abstract
An example embodiment relates to a method of manufacturing an array of electric devices that includes attaching a platform including a micro-channel structure to a substrate. The method includes injecting first and second solutions into the micro-channel structure to form at least three liquid film columns, where the first and second solutions include different solvent composition ratios and the liquid columns each, respectfully, include different solvent composition ratios. The method further includes detaching the platform the substrate, removing solvent from the liquid film columns to form thin film columns, and treating the thin film columns under different conditions along a length direction of the thin film columns. The solvent is removed from the thin film columns and the thin film columns are treated under different conditions along a length direction of the thin film columns.