The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Aug. 07, 2012
David Van Steenwinckel, Holsbeek, BE;
Thomas Merelle, Dresden, DE;
Franciscus Petrus Widdershoven, Eindhoven, NL;
Viet Hoang Nguyen, Leuven, BE;
Dimitri Soccoi, Heverlee, BE;
Jan Leo Dominique Fransaer, Leefdaal, BE;
David Van Steenwinckel, Holsbeek, BE;
Thomas Merelle, Dresden, DE;
Franciscus Petrus Widdershoven, Eindhoven, NL;
Viet Hoang Nguyen, Leuven, BE;
Dimitri Soccoi, Heverlee, BE;
Jan Leo Dominique Fransaer, Leefdaal, BE;
NXP, B.V., Eindhoven, NL;
Abstract
A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed.