The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Feb. 19, 2009
Masami Aihara, Kakogawa, JP;
Masami Aihara, Kakogawa, JP;
Harima Chemicals, Inc., Hyogo, JP;
Abstract
Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic componentis mounted on a main surfaceof a substrate having an electrode sectionand an insulating film, and the electrode sectionand the electronic componentare electrically bonded to each other through a solder section, and a flux residueexuded from the solder sectionis present between the electronic componentand the insulating film. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than −40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10/K or less of linear thermal expansion coefficient within a temperature range from −40° C. to the softening temperature of the flux residue.