The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Mar. 24, 2011
Applicants:
Hitoshi Yoshida, Otsu, JP;
Hidekazu Yoshioka, Yawata, JP;
Takaaki Suzumura, Ritto, JP;
Jiro Koyama, Otsu, JP;
Inventors:
Hitoshi Yoshida, Otsu, JP;
Hidekazu Yoshioka, Yawata, JP;
Takaaki Suzumura, Ritto, JP;
Jiro Koyama, Otsu, JP;
Assignee:
OMRON Corporation, Kyoto-shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/24 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a metal component includes the steps of forming a resist film on a surface of an electrode plate, making the resist film exposed to light by use of a photomask having a mask pattern, in at least part of a rim of which a fine concavity and convexity are drawn, developing the resist film, to form an opening for molding in the resist film, and epositing an electroforming material by electroforming inside the opening for molding, to mold the material.