The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Sep. 16, 2011
Catherine Procik Dulka, West Chester, PA (US);
Young Jin Kim, Clifton Park, NY (US);
Rajasingh Schwartz Israel, Westlake, OH (US);
David Wesley Sandusky, Los Gatos, CA (US);
Kevin H. Janora, Schenectady, NY (US);
Peter W. Brown, Twinsburg, OH (US);
Tianji Zhao, Mayfield Heights, OH (US);
Catherine Procik Dulka, West Chester, PA (US);
Young Jin Kim, Clifton Park, NY (US);
Rajasingh Schwartz Israel, Westlake, OH (US);
David Wesley Sandusky, Los Gatos, CA (US);
Kevin H. Janora, Schenectady, NY (US);
Peter W. Brown, Twinsburg, OH (US);
Tianji Zhao, Mayfield Heights, OH (US);
General Electric Company, Schenectady, NY (US);
Abstract
Example embodiments relate to a method and apparatus for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously, to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method may include depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path to attain the apparatus. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.