The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2014

Filed:

Oct. 06, 2010
Applicants:

Rika Nomura, Yokohama, JP;

Hiroaki Furuichi, Kawasaki, JP;

Eiji Tsubono, Yokohama, JP;

Shoji Matsumoto, Kawasaki, JP;

Inventors:

Rika Nomura, Yokohama, JP;

Hiroaki Furuichi, Kawasaki, JP;

Eiji Tsubono, Yokohama, JP;

Shoji Matsumoto, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 7/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In connecting flexible printed circuits, a structure with improved connection strength of the connection portion is provided. In this structure in which a first flexible printed circuit and a second flexible printed circuit are connected to each other, a through-hole is provided on the second flexible printed circuit, and a resin member passes through the through-hole and is adhered to the wires of a connection surface of the first flexible printed circuit and the side of the second flexible printed circuit opposite to the connection surface, whereby impact is absorbed by the elasticity of the resin; as for the first flexible printed circuit, adhesion is performed on a metal in a wiring layer with high adhesion strength, while as for the second flexible printed circuit, adhesion is performed on the back side upon which no peeling stress is exerted, improving joining strength to prevent peeling.


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