The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Jan. 25, 2010
Dale C. Flanders, Lexington, MA (US);
James W. Getz, Harvard, MA (US);
Peter S. Whitney, Lexington, MA (US);
Mark E. Kuznetsov, Lexington, MA (US);
Christopher C. Cook, Bedford, MA (US);
Dale C. Flanders, Lexington, MA (US);
James W. Getz, Harvard, MA (US);
Peter S. Whitney, Lexington, MA (US);
Mark E. Kuznetsov, Lexington, MA (US);
Christopher C. Cook, Bedford, MA (US);
Axsun Technologies, Inc., Billerica, MA (US);
Abstract
An optical probe for emitting and/or receiving light within a body comprises an optical fiber that transmits and/or receives an optical signal, a silicon optical bench including a fiber groove running longitudinally that holds an optical fiber termination of the optical fiber and a reflecting surface that optically couples an endface of the optical fiber termination to a lateral side of the optical bench. The fiber groove is fabricated using silicon anisotropic etching techniques. Some examples use a housing around the optical bench that is fabricated using LIGA or other electroforming technology. A method for a forming lens structure is also described that comprises forming a refractive lens in a first layer of a composite wafer material, such as SOI (silicon on insulator) wafers and forming an optical port through a backside of the composite wafer material along an optical axis of the refractive lens. The refractive lens is preferably formed using grey-scale lithography and dry etching the first layer.